microSTRUCT compactTM



Due to the advancing miniaturization in electronics, semiconductor manufacturing and medicine technology, it has increasingly become indispensable to possess the capability of machining smaller and finer structures into most various substrates. Substrates to be machined may be of any nature – i.e. metals, alloys, ceramics, transparent material, or biological material. The microSTRUCT compactTM workstation is perfectly suited for all of these substrates.

Laser source (selectable, sample configuration)

  • Integration of two laser sources and three beam paths for different wavelengths are possible

  • Standard laser source: ns Laser 1064 nm with SHG and THG

  • Further available laser types (ps, ns, fs, fiber-/disc laser), laser optics, scanner systems and fixed optics are integrable


System description (sample configuration):

  • Direct-driven positioning system
  • XY-traverse path 600 mm x 400 mm
  • Positioning accuracy ± 0,01 mm
  • Repeatability ± 0,005 mm
  • Travel speed max. 150 mm/s
  • Acceleration max. 100 mm/s²
  • Positioning system is upgradeable with goniometers and lifting tables
  • Integration of special positioning system on customers demand
  • Manual, semi automated or fully automated workpiece alignment with XY-system and optical measurement system are available
  • Adaption to different heights of workpieces by using a separate Z positioning system
  • 2 working areas for using scan systems, fixed optics or helical drilling optics
  • Working area for every station: 300 mm x 300 mm
  • On request one station can be used as measuring station
  • The system is prepared for integration of an exhaust system for suction of ablated material
  • Multilingual software based on english
  • Full worldwide remote access via network
  • Customized log file to store all commands, processes and laser parameters
  • Separate modes for operators, supervisors and service
  • Programming in Visual Basic Script or via data import
  • Interfaces GDS II, STL, DXF
  • Addressing of up to 32 NC axes
  • Intuitive graphical operator interface with preview
  • Image recognition system
  • Integrated energy monitor

Options

  • Fully automated workpiece handling

  • Integrated picture recognition system with up to four observation cameras

  • Optical or tactile distance sensor

  • Vacuum chuck or other chuck devices on request

  • Quality control systems are available on customers demand

Full description for download Full description for download (276.6 kB)

-