microPULSE

In research and development it has increasingly become indispensable to possess the capability of machining smaller and finer structures into most various substrates. Substrates to be machined may be of any nature - say metals, alloys, ceramics, transparent material, or biological material. The microPULSE is perfectly suited for all of these substrates. The major advantages of this workstation are:
  • Maximal degree of freedom regarding the positioning of the substrates
  • Open system concept for the integration of most different lasers or laser sources operated parallel
  • Flexible, upgradeable control concept for possible future integration of further components (i.e. additional axes systems, additional optical components, etc.)

The microPULSE has particularly been designed for the utmost various tasks posed in micromachining, such as drilling of micro holes, creating micro structures, or micro cuts. Dependent on the chosen laser type, materials with high thermal conductivity and low melting temperatures are machined as easily as transparent, semi conducting, superconducting, or organic materials. Thanks to constantly improving lasers, powerful and reliable systems are available today. These high-performance systems enable the precise machining of almost any material. The positioning of the substrates is performed by a 5 axes positioning system consisting of three linear axes and two goniometers. Two direct-driven linear axes position the substrates in x and y. The Z axis is a limited spindle axis. The two goniometers enable an angular positioning of the substrates with respect to the x/y plane. The versatile concept of the microPULSE also provides the possibility of extending it by additional positioning systems - for instance additional rotational axes.


The control of the workstation will be done by an IPC and the control software microMMI with the following features:

  • Multilingual software based on English
  • Full worldwide remote access via network
  • Customized log file to store all commands, processes and laser parameter
  • Separate modes for operators, supervisors and service
  • Programming in Visual Basic Script or via data import
  • Interfaces GDS II, STL, DXF
  • Addressing of up to 32 NC axes
  • Intuitive graphical operator interface with preview
  • Integrated vision system

Laser source

  • Picosecond laser
  • 1064 nm (optional 532 nm, 355 nm, and 266 nm)
  • Repetition rate 1 - 500 kHz
  • Beam profile TEM00
  • Maximum energy 20 µJ
  • Average power 10 W
  • Pulse width < 20 ns

Options

  • Scanner with different working areas and resolutions
  • Semi automated or fully automated alignment with camera system
  • Automated workpiece handling
  • Fully air conditioned processing chamber
  • Customer specific mini environments up to ISO class 4
  • Beam analyser featuring microPROFILER software
  • Workpiece mounts on customer’s demand
  • Rotational axis for customer-specific tasks
  • Integrated energy monitor

Housing/Base frame

  • Rugged base frame made of steel with bread board/base plate or granite
  • Housing for laser class 1

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