The development in the area of electronics and photovoltaics has been tending to more and more reliability, less weight, cheaper production and flexibility over the last years. Result of this development is a steady growing demand by the industry for thin-film processing systems. Those systems have to ensure high efficiency rates and big process areas. In order to fulfill these requirements, 3D-Micromac developed the laser micromachining system microFLEX^TM for ablation of thin films on flexible substrates. This system works in a reel-to-reel process and thus it is able to reduce the effort for the production of devices.

The modular design of microFLEX^TM ensures high flexibility regarding different areas of component production for flexible electronics.  Flexible solar cells, both on CIS/CGIS and organic standards, printed batteries, RFID-labels and rollable displays can be processed.

3D-Micromac AG is presenting a complete production line for manufacturing of flexible electronics from raw material to an encapsulated product for the first time.  Beside the integration of laser processing, also printing and coating technology, like engraving, Ink-Jet printing und Slot Die Coating can be offered.

Thereby the modular design allows an individual adjustment on the requirements and growth of clients and the market.

About 3D-Micromac AG