3D-Micromac presents new design line
Just in time for LASER World of Photonics 2011, 3D-Micromac AG is presenting its all new design concept that is applied to the microSTRUCT C laser system for the first time.
The company's new design line stands for modernity, flexibility and uniqueness. The goal of the new design development was the creation of uniform design features that can be adapted to future 3D-Micromac products.
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microSTRUCT Machining Area
3D-Micromac AG presents picosecond laser system microSTRUCT C
Caused by a progressing trend to miniaturization in electronics, semi-conductor production and medical engineering it is compulsory necessary to reach continually smaller and more particularized structures in various substrates. Traditional production technologies reach their limits. The processing by ultra short pulse lasers offers best conditions for the required quality and precision due to an almost athermal ablation.
Therefore, 3D-Micromac AG developed a compact, modular constructed system for processing with ultra short pulse lasers in order to fit these requirements and successfully placed it on the market. In addition to an individual design of this system, 3D-Micromac focused on high quality, precision, reliability and flexibility.
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The development in the area of electronics and photovoltaics has been tending to more and more reliability, less weight, cheaper production and flexibility over the last years. Result of this development is a steady growing demand by the industry for thin-film processing systems. Those systems have to ensure high efficiency rates and big process areas. In order to fulfill these requirements, 3D-Micromac developed the laser micromachining system microFLEX for ablation of thin films on flexible substrates. This system works in a reel-to-reel process and thus it is able to reduce the effort for the production of devices.
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The sector of organic electronics in general has seen great progress in the last years. While the first applications of organic conductive materials were proof-of concept devices, today more and more real applications emerge. Among these organic LEDs (OLEDs) and organic photovoltaics (OPVs) are of great interest for a number of reasons. Compared to the production steps of conventional inorganic solar cells which involve etching processes with highly toxic and environmentally harmful chemicals, the production of organic solar cells is largely unproblematic.
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microWELD
3D-Micromacs microWELD paves the way for new product designs
Especially in medical technologies the production of instruments and implants is characterized by a trend of miniaturization and highest demands in view of surface quality, particle free processing, cleanness and avoidance of material residues. For this, new methods of production are required, because traditional methods have already reached their limit.
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microWELD
3D-Micromac successful introduced a new laser system for welding of metals
The manufacturing of medical instruments and implants is characterized by smaller and smaller structures as well as the demand for highest precision in terms of surface quality, absence of burr, and materials residues. While established fabrication technologies increasingly face their limits, laser micromachining provides optimum preconditions for the required quality and precision since machining is accomplished in a contactless fashion.
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Highest throughput and efficient material utilization by using of ultra short pulsed laser
Organic light emitting diodes (OLED) are electronic devices with a total thickness of a few millimeters sending out light. OLEDs are composed of different organic semiconductor thin film layers. Typical are a high image quality at a wide viewing angle and less energy consumption. That is the reason why OLEDs are mostly used in small portable units, e.g. displays of mobile phones.
During the manufacturing process of an OLED the different thin film layers needs to be structured. Up to now mechanical or wet chemical technologies were used. A new and innovative solution for structuring these thin films is selective laser structuring.
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The contribution of laser technologies to increase the efficiency of solar cells
Driven by ecological awareness and short-running fossil combustibles, photovoltaic is gaining ever increasing importance for the production of energy. In order to achieve a reduction of manufacturing costs and increase the efficiency in parallel, e.g. the cell design of solar cells is continuously developed and improved. One approach is the so-called Back-Contact Cell Design. With it, the efficiency of solar cells can be significantly improved by a redesign of the front-side contacts that are covering considerable portions of the active area. The basic idea is to shift as much contact area as possible towards the back side of the cell. This is achieved by drilling holes of different size using a laser. Employing the EWT (emitter wrap-through) concept, electrical contacts are being transferred from the front side towards the rear side. One of the obstacles for the industrial use of the EWT-technology so far was the relatively low throughput with high investment costs.
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Due to their excellent focusability, lasers are almost perfectly suited for the drilling of very fine holes. For the drilling of plastics, excimer lasers are utilised while the machining of metals and semiconductors is accomplished with DPSS laser sources or picosecond lasers.
Blind holes as well as clearance holes can be obtained. A particularly large development potential is attached to the usage of novel helical drilling heads for the generation of micro holes (diameter > 50 µm) with precisely controllable taper in up to 2 mm thick metal sheets. With the advent of the latter technology, entirely new perspectives for design and functionalization of new products are opened.
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microSTRUCT PVario
Highest material throughput with least possible material damage through contact-free removal
In order to achieve the reduction of manufacturing costs and to increase the efficiency in parallel, manufacturers of solar cells readily invest in state-of-the-art production lines. In such fabs, the utilization of lasers guarantees high efficiency and throughput at best attainable precision and minor damage to the cells.
3D-Micromac AG now offers its laser micromachining workstation microSTRUCT PVario and therewith includes a system into its product portfolio, which is especially used for photovoltaic applications in research and development environ-ments. The system is suitable for the processing of fragile silicon wafers and thin-film systems.
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Data-matrix code for enhanced traceability of products used in medicine and pharmacy, generated with an ultrashort pulsed laser
Traceability of products in medicine and pharmacy using inextinguishable ID codes is gaining importance due to drug-tracking regulations increasingly pursued by EMEA (European Medicines Agency) as well as FDA (Federal Drug Asso-ciation). Such verification is, in particular, intended to reduce the globally increasing fraction of low-grade product copies.
Using dedicated ultrashort pulse lasers, 3D-Micromac AG has developed a novel technology for marking transparent materials for these reasons. In this cutting-edge approach, the marking is - different from conventional methods - not placed on the material but within the container.
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Highest throughput at extreme precision
3D-Micromac AG, leading supplier of tailored laser micro¬machining systems, announces the launching of a dedicated workstation for efficient and at the same time highly precise generation of micro holes for back-side contacting of emitter wrap-through (EWT) solar cells. The novel machining concept is based on the approved microDrill family.
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Hole in stainless steel, 80 µm - cross section
The drilling of microholes with well-defined geometry is becoming increasingly important in various branches of industry. Applications range from injection nozzles (automotive) over cooling openings in turbine stator vanes (aerospace) and emitter-wrap through perforations (solar) to spinnerets required to adopt more and more complex shapes for the fabrica-tion of functional fibres (textile industry).
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Roll to roll laser process
High material throughput with lowest manufacturing costs
CHEMNITZ – 24 July 2007 – 3D-Micromac AG, a leading supplier of customized laser micro machining systems now offers the development and production of roll-to-roll laser processing for ablation of thin film on flexible substrates.
Extreme flat and flexible electronic devices are capturing many fields of our daily life. Due to this fact there are systems required which can reach a high throughput with lowest manufacturing costs, especially for new product developments. Roll-to-roll manufacturing methods can reduce the expenses severely.
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Wafer frontside
CHEMNITZ – 14th May 2007 – MEMS fabrication technologies cause tolerances in device dimensions and consequently on key parameters like the resonant frequency. In contrast to these manufacturing tolerances industrial applications require defined conditions.
Therefore 3D-Micromac AG has developed an industrial-applicable laser-trimming tool to overcome these tolerances. The processing of Silicon in particular Micro Mirror Devices (MMD) by ultra-short pulse is accompanied by a very small heat affected zone and causes a minimum of stress into the material. The trimming of all MMDs on a wafer to a certain frequency value is performed by selective ablation of material. The reported technology promises an increasing yield and maximizes the efficiency in MEMS production because a post fabrication tuning of the resonant frequency by software is no longer necessary.
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