Picosecond Laser Station

In an industrial environment, laser-machining systems mainly depend on one single characteristic: performance. This demand, combined with the request to fabricate increasingly small structures, is met by the novel, highly repetitive picosecond lasers implemented into micromachining workstations by 3D-Micromac.

Wherever precise high-speed machining of metals or semiconductors is needed, picosecond lasers present excellent tools accomplishing optimum results.



The Picosecond Laser Workstation by 3D-Micromac has particularly been designed for the utmost various tasks posed in micromachining, such as drilling of micro holes, creating micro structures, or micro cuts. Dependent on the chosen laser type, materials with high thermal conductivity and low melting temperatures are machined as easily as transparent, semi conducting, superconducting, or organic materials. Thanks to constantly improving lasers, powerful and reliable systems are available today. These high-performance systems enable the precise machining of almost any material. The positioning of the substrates is performed by a 5 axes positioning system consisting of three linear axes and two goniometers. Two direct-driven linear axes position the substrates in x and y. The Z axis is a limited spindle axis. The two goniometers enable an angular positioning of the substrates with respect to the x/y plane. The versatile concept of the PS-Workstation also provides the possibility of extending it by additional positioning systems - for instance additional rotational axes.


The control of the workstation will be done by an IPC and the control software microMMI with the following features:

  • Multilingual software based on English
  • Full worldwide remote access via network
  • Customized log file to store all commands, processes and laser parameter
  • Separate modes for operators, supervisors and service
  • Programming in Visual Basic Script or via data import
  • Interfaces GDS II, STL, DXF
  • Addressing of up to 32 NC axes
  • Intuitive graphical operator interface with preview
  • Integrated vision system

Laser source

  • Picosecond Laser
  • Wavelengths 1064 nm (optional SHG/THG)
  • Repetition rate 50 kHz
  • Beam profile TEM00
  • Maximum energy 20 µJ
  • Average power 10 W
  • Pulse width < 15 ps
Spinereds of stainless steel
Spinnerets made of stainless steel
Options
  • Scanner with diverse fields of work and resolutions
  • Semi-automated or fully automated alignment with camera system
  • Automated workpiece handling
  • Vacuum-Chuck
  • Mounts for 300 mm wafer
  • Purpose-build mounts for masks
  • Customer-specific workpiece mounts
  • Fully air-conditioned processing chamber
  • Mini environment up to ISO class 4
  • Beam analyser featuring microPROFILER software
  • Integrated energy monitor

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